Comparison ledger
Axcelis 200 ACU, Ulvac NE 950, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | NE 950Ulvac |
|---|---|---|
| OEM | Axcelis | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Ulvac NE 950 |
| Cited variants | — | |
| Specifications | ||
| Configuration | Parts Machine[2] | — |
| Manufacturer | Axcelis[2] | Ulvac[6] |
| Model | 200 ACU[2] | NE 950[6] |
| Tool type | Asher[2] | ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch) system[7] |
| Wafer size | 200mm[4] | 2" to 12" wafers[7] |
| Serial number | AU6A356AH[4] | — |
| Computer system | M 200 PC, M 200[5] | — |
| Part number | SC 4572 A[5] | — |
| Volts | 208[5] | — |
| Amps | 30[5] | — |
| Equipment type | Asher[2] | — |
| Wafer configuration | 8 inch[3] | — |
| Category | — | Etch[7] |
| Wafer description | — | chamber described for 2" to 12" wafers[7] |
| Process type | — | ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch)[7] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →