Comparison ledger
ASML 5500 350 C, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 5500 350 CASML | 101EV Group |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML 5500 350 C | EV Group 101 |
| Cited variants |
| — |
| Specifications | ||
| Configuration | With:[2] | — |
| Laser source | Cymer ELS 5600 excimer laser[2] | — |
| Wafer size (configured) | 100 mm (4 inch)[1] | — |
| Vintage year | 1997[2] | — |
| Cluster configuration | In-line with TEL Clean Track ACT-8 coater/developer[1] | — |
| Model | 5500 / 350 C[2] | 101[3] |
| Equipment type | Stepper[2] | — |
| Cluster pairing | In-line with the ASML PAS5500/350C stepper to form a DUV lithography cluster[1] | — |
| Configured wafer size | 100 mm (4") wafers[1] | — |
| Alternate designation | ASML PAS 5500/350C[1] | — |
| OEM | — | EV Group[3] |
| Equipment name | — | EVG 101 Spray Coater[3] |
| NEMO ID | — | evgspraycoat[3] |
| Training required | — | EVG 101 Training[3] |
| Training duration | — | 1.50 hours[3] |
| Processing technique | — | Resist Spray Coat (manual)[3] |
| Cleanliness | — | "All"[3] |
| Location | — | SNF Paul G Allen L107 Cleanroom[3] |
| Wafer diameter (substrate size) | — | up to 300 mm[4] |
| Available modules | — | Spin coat / OmniSpray® / develop[4] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[4] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[4] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[5] |
| Cleanliness group (at SNF) | — | "All"[3] |
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