Comparison ledger
ASM Sonora Vertical, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | ASM | CEE |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2022 Product launch announcement | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM Sonora Vertical | CEE 1000 Hot Plate |
| Specifications | ||
| Wafer Sizes | 12 inch[1] | — |
| Dual reactor chambers | Yes[2] | — |
| Wafer Size | 300mm[2] | 4 inch[3] |
| Throughput | Highest available throughput in its class; 30% more productivity than predecessor[2] | — |
| Reactor Utilization | Virtually 100%[2] | — |
| Reactor count | 2 (dual boat reactors)[2] | — |
| Interface | Intuitive graphical user interface[2] | — |
| Process capabilities | LPCVD (doped silicon, silicon nitride), diffusion (wet oxidation, anneal), ALD[2] | — |
| Compatibility | Fully compatible with A412; existing recipes easily transferred[2] | — |
| Gas injection system | Innovative gas injection system for low pressure processing providing best uniformities between wafers at larger load sizes[2] | — |
| Load size | Larger process wafer load sizes than its predecessor[2] | — |
| Byproduct reduction | Lower energy and chemical usage per wafer compared to predecessor[2] | — |
| Predictive maintenance | Advanced control diagnostics for predictive maintenance[2] | — |
| Installation | Plug & play installation[2] | — |
| Configuration | — | 4"[3] |
| Type | — | Hot Plate[3] |
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