Waferpedia

Comparison ledger

Reflexionversus100R16

Applied Materials Reflexion, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ReflexionApplied Materials
100R16Strasbaugh
OEMApplied MaterialsStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials ReflexionStrasbaugh 100R16
Cited variants
  • Reflexion LK[1]
  • Reflexion LK Prime[1]
—
Specifications
ConfigurationDielectric, LK Oxide[2]—
Wafer Sizes12 inch[2]—
Process TypeChemical Mechanical Polishing (CMP)[2]—
OEMApplied Materials[2]—
ModelReflexion[2]—
CategoryCMP (Chemical Mechanical Polisher)[2]—
Wafer Size12 inch[2]—
type—1 spindle grinder/polisher[5]
drive system—DC drive system with 2 motors[5]
spindle RPM—1-180 RPM[5]
eccentric RPM—1-90 RPM[5]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[5]
capacity—16 inches[5]
spindle size—1-8 TPI[5]
overall dimensions—28 inches x 36 inches x 48 inches[5]
weight—500 lbs[5]
origin—made in the USA[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]patents.google.compatents.google.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]excelltechnology.comexcelltechnology.com