Comparison ledger
Applied Materials Reflexion, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ReflexionApplied Materials | 12 LapperLapmaster |
|---|---|---|
| OEM | Applied Materials | Lapmaster |
| Category | CMP | CMP |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials Reflexion | — |
| Cited variants | — | |
| Specifications | ||
| Configuration | Dielectric, LK Oxide[2] | — |
| Wafer Sizes | 12 inch[2] | — |
| Process Type | Chemical Mechanical Polishing (CMP)[2] | — |
| OEM | Applied Materials[2] | — |
| Model | Reflexion[2] | — |
| Category | CMP (Chemical Mechanical Polisher)[2] | — |
| Wafer Size | 12 inch[2] | — |
| Outside plate diameter | — | 12 inches[5] |
| Lapping Speed Range | — | 0 to 60 rpm[6] |
| Wafer Size Compatibility | — | 4 inches or smaller[5] |
| Input Voltage | — | 110 V[5] |
| Frequency | — | 60 Hz[5] |
| Phase | — | 1[5] |
| Number of Rings | — | 3[5] |
| Number of Weights | — | 3[5] |
| Includes Slurry System | — | Yes[5] |
| Includes Timer | — | Yes[5] |