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Comparison ledger

HEXP VIISta HEversusNV 8250

Applied Materials HEXP VIISta HE, Axcelis NV 8250, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Ion Implantation, Unknown[1]
Side-by-side comparison of selected equipment models
Attribute
HEXP VIISta HEApplied Materials
NV 8250Axcelis
OEMApplied MaterialsAxcelis
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials HEXP VIISta HEAxcelis NV 8250
Specifications
ConfigurationIncludes:[2]Backside[4]
ChillerSMC remote 20M[2]—
Cryo Pump320FE CRYO OBIS,6[3]—
Cryo Pump ExhaustSS Cryo Exhaust Through Roof[3]—
Cryo CompressorIS-1000 KPa X 3[3]CTI 8500[1]
DosimetryAdvanced[2]—
FacilitiesFaci fr Botm(Air-N2-H2O-Power)[3]—
Frequency60 Hz Operation[3]—
Label KitEnglish[2]—
Load Lock Vent500 Load LockVent Std Finish[3]—
Load Lock Vent Connection500 Vent Con Std Finish[3]—
ManometerTriple Manometer 0-1 kPa[2]—
Power KitStandard Power Kit[2]—
ProfilerStandard Rack and Pinion[2]—
Remote Harness Kit20M Rem Facilites Kit - Floor[2]—
RP3 ExhaustRP3 PVC Exhaust Line - Roof[3]—
Wafer Size8 inch (200mm)[2]—
Platen Type200mm SiC[2]—
Source MaterialSiC[2]—
UPS/CVCFStandard UPS 3KVA - No CVCF[2]—
VCS Software PackageVCS 9.XX (Specify revision)[2]—
Roughing Pump SupplyCustomer Supplied Pumps Onsite[2]—
Turbo Pump SupplyVSE Supplied Pumps[2]—
Wafer Handler Side Window KitWindows[2]—
Wafer Sizes—8 inch[1]
Energy Range—0-250 keV[1]
Power Requirement—208 VAC, 100 A, 50/60 Hz, 3 Phase[1]
Programmable Auto Tilt—0-75 degrees[1]
Single Stage Extraction—15-40 keV[1]
Ion Source Type—ELS[1]
Source Material Type—Moly[1]
Electrostatic Chuck (ESC)—Yes[1]
Parallel Beam using Hybrid Scanning—Yes[1]
90 degrees Radially Indexed Dipole Magnet—Yes[1]
Signal Tower—Yes[1]
SECS II / GEM Interface—Yes[1]
Cassette Interface—Asyst Bolt-On SMIF (2), Cassette Stages (3), Automatic Flat/Notch Alignment, Programmable Flat Orient[1]
Controller—Sun Sparc Station V, Application SW Ver. 4.3.2, Auto Start-Up & Computer Monitoring[1]
Pump / Cryogenics—Source Pump: TMP; Beam Pump: TMP (2) and Cryo Pump (8" Torr, Non On-board); End Station Pump: 2 Cryo Pump (8" Torr, Non On-Board); Cryo Compressor: CTI 8500; Remote Disk Chiller[1]
Gas Configuration—AsH3 - SDS, PH3 - SDS, BF3 - SDS, Ar - HP[1]
Energy Filter System Option—Yes[1]
Vintage—1999 (Backside)[4]
Source Pump—TMP[1]
Beam Pump—TMP (2)[1]
End Station Pump—2 Cryo Pump (8" Torr, Non On-Board)[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing