Comparison ledger
Applied Materials 0720 06060 Part, Bruker Tespa, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0720 06060 PartApplied Materials | TespaBruker |
|---|---|---|
| OEM | Applied Materials | Bruker |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0720 06060 Part | Bruker Tespa |
| Specifications | ||
| Configuration | Contact Pin 24-20 Awg Crimp Gold Flash[1] | — |
| Make | — | Bruker[2] |
| Model | — | Tespa[2] |
| Product type | — | Prober[2] |
| TESPA-V2 package quantity | — | Pack of 10[3] |
| TESPA-V2 probe type | — | High quality etched silicon probes[3] |
| TESPA-V2 application modes | — | TappingMode and other non-contact modes[3] |
| TESPA-V2 mounting | — | Unmounted for use on standard AFMs[3] |
| TESPA-V2 geometry | — | Rectangular[3] |
| TESPA-V2 tip radius | — | 7-10 nm[3] |
| TESPA-V2 frequency | — | 320 kHz nominal; 270-370 kHz min/max[3] |
| TESPA-V2 spring constant | — | 37 N/m nominal; 19-55 N/m min/max[3] |
| TESPA-V2 length | — | 123 µm nominal; 120-125 µm min/max[3] |
| TESPA-V2 width | — | 40 µm nominal; 37-42 µm min/max[3] |
| TESPA-V2 cantilever thickness | — | 3.3 µm nominal; 2.8-3.8 µm range[3] |
| TESPA-V2 cantilever material | — | Si[3] |
| TESPA-V2 reflex coating | — | Reflective Aluminum[3] |
| TESPA-V2 tip height | — | 12.5 µm nominal; 10-15 µm range[3] |
| TESPA-V2 front angle | — | 25° nominal; 22.5-27.5° range[3] |
| TESPA-V2 back angle | — | 17.5° nominal; 15-20° range[3] |
| TESPA-V2 side angle | — | 20° nominal; 17.5-22.5° range[3] |
| TESPA-HAR geometry | — | Rectangular[4] |
| TESPA-HAR tip radius | — | 10-15 nm[4] |
| TESPA-HAR frequency | — | 320 kHz nominal; 230-410 kHz min/max[4] |
| TESPA-HAR spring constant | — | 42 N/m nominal; 20-80 N/m min/max[4] |
| TESPA-HAR length | — | 125 µm nominal; 110-140 µm range[4] |
| TESPA-HAR width | — | 40 µm nominal; 30-50 µm range[4] |
| TESPA-HAR application note | — | Ideal for TappingMode imaging on samples with tall/deep geometries, such as semiconductor trench imaging[4] |
| TESPA-HAR tip height | — | 10-15 µm[4] |
| TESPA-HAR tip angles | — | Front 5° ± 1°, back 5° ± 1°, side 5° ± 1°[4] |
| TESPA-HAR cantilever thickness | — | 4 µm nominal; 3.25-4.75 µm range[4] |
| TESPA-HAR back side coating | — | Reflective Aluminum[4] |
| Type | — | AFM probe[5] |
| Use mode | — | TappingMode and other non-contact modes[3] |
| Probe material | — | etched silicon[3] |
| Geometry | — | rectangular[3] |
| Cantilever material | — | Si[3] |
| Tip radius | — | 7 to 10 nm[3] |
| Frequency | — | 320 kHz[3] |
| Spring constant | — | 37 N/m[3] |
| Length | — | 123 µm[3] |
| Width | — | 40 µm[3] |
| Cantilever thickness | — | 3.3 µm[3] |
| Reflex coating | — | Reflective aluminum[3] |
| Tip height | — | 12.5 µm[3] |
| Front angle | — | 25°[3] |
| Back angle | — | 17.5°[3] |
| Side angle | — | 20°[3] |
Plan your fab
Building a Test & Probe process? Get a complete equipment list.
Open the fab equipment planner →