Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, SUSS MicroTec FC 250, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | FC 250SUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | SUSS MicroTec FC 250 |
| Specifications | ||
| Configuration | — | With a Julabo FLW1703 Chiller[1] |
| Maximum chip/substrate temperature | — | 450°C[2] |
| Bonding force range | — | 10 gf to 200 kgf[2] |
| Alignment accuracy (X/Y) | — | 1 µm at 3σ[2] |
| Optical magnification | — | 400X[2] |
| Objective numerical aperture | — | 0.3[2] |
| Heating rate | — | 30 °C/s to 100 °C/s[2] |
| Stage resolution | — | 0.1 µm[2] |
| Minimum device size | — | 250 µm × 300 µm[2] |
| Granite plate flatness | — | 2 µm[2] |
| Stage size | — | 2 × 2 inches[1] |
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