Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Esec 2100 HS, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 2100 HSEsec |
|---|---|---|
| OEM | Applied Materials | Esec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Esec 2100 |
| Cited variants | — | |
| Specifications | ||
| Configuration | — | 208-240 Vac[3] |
| Power | — | 2.3 kVA[3] |
| Wafer size | — | 8" wafer ring loader[4] |
| Tool type | — | Die bonder[3] |
| Wafer handling | — | 8" wafer ring loader[5] |
| Power supply | — | 208 - 230 VAC (@ 47 - 63 Hz), 800 - 1100VA[6] |
| Bond force | — | 0.2 to 20 N[6] |
| Placement speed | — | Up to 18500 UPH[6] |
| X Y placement accuracy | — | 20 µm[6] |
| Overall dimensions | — | 1785 x 1448 x 1400 mm[6] |
| Net weight | — | 1400 kg[6] |
| Mean time between failure | — | > 200 h[6] |
| Machine type | — | Die bonder[2] |
| Process | — | Epoxy die attach applications[2] |
| Bonding method | — | Epoxy[2] |
| Bonding accuracy | — | 20 µm @ 3σ (15 µm option)[2] |
| Cycle time | — | 120 ms with Liquid Cooling option[2] |
| Leadframe size | — | Length: 90 to 300 mm; Width: 23 to 100 mm[2] |
| Machine dimensions | — | 1785 x 1448 x 1400 mm (W x D x H)[2] |
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