Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, ASM Eagle 60, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | Eagle 60ASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | 2002– |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | ASM Eagle 60 |
| Specifications | ||
| Voltage | — | 240 V[1] |
| Configuration | — | 50/60 Hz[1] |
| Phase | — | 1 Phase[1] |
| Frequency | — | 50/60 Hz[1] |
| Minimum bond pitch | — | 35 micron[2] |
| Wire type | — | Gold[2] |
| Productivity improvement | — | 20% higher than predecessor[2] |
| Wire bonding type | — | Gold wire bonding[2] |
| Fine pitch capability | — | 35 microns[2] |
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