Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, KLA Profilm 3 D Optical, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | KLA |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | KLA Profilm |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | OBJ-10X-Mirau 10x Nikon Mirau interferometric objective lens[2] |
| Measurement principle | — | Vertical Scanning Interferometry (VSI) and Phase-Shifting Interferometry (PSI)[3] |
| Thickness range (VSI) | — | 50 nm – 100 mm[3] |
| Thickness range (PSI) | — | 0 – 3 µm[3] |
| Reflectance range | — | 0.05% – 100%[3] |
| Piezo scan range | — | 500 µm[3] |
| XY stage options | — | 100 mm × 100 mm or 200 mm × 200 mm[3] |
| Objectives | — | 5X, 10X, 20X, 50X, 100X[4] |
| Sample max width | — | 265 mm (Profilm3D); 365 mm (Profilm3D-200)[4] |
| System weight | — | 15 kg (Profilm3D); 22 kg (Profilm3D-200)[4] |
| Model configuration | — | OBJ-10X-Mirau 10x Nikon Mirau interferometric objective lens; WSProfilm3D-200 manual rotating (r-theta) stage for 200mm wafers; Profilm-AnalysisSoftware permanent license; UPG-PSI upgrade; Accurion Nano30 active vibration isolation system; stitching not included[2] |
Plan your fab
Building a Metrology & Inspection process? Get a complete equipment list.
Open the fab equipment planner →