Waferpedia

Comparison ledger

0010-16392 ESC AssemblyversusTelius SP Dry

Applied Materials 0010-16392 ESC Assembly, Tokyo Electron Telius SP Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-16392 ESC AssemblyApplied Materials
Telius SP DryTokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-16392 ESC AssemblyTokyo Electron Telius SP Dry
Specifications
OEMApplied Materials[1]—
Model0010-16392[1]—
TypeESC Assembly[1]—
Wafer Size300 mm[2]—
Electrode ConfigurationDual[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]spwindustrial.comspwindustrial.com