Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Takatori ATM 8100 S, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | ATM 8100 STakatori |
|---|---|---|
| OEM | Applied Materials | Takatori |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Takatori ATM |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | Non-operational[5] |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | 6 inch; 8 inch[6] |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Machine type | — | Automatic Wafer Mounter[6] |
| Application | — | Mounting wafers to dicing frames before the dicing process[6] |
| Throughput | — | 80 wafers/h[6] |
| Frame size | — | 6 inch W 230mm; 8 inch W 300mm[6] |
| Tape width | — | 6 inch W 230mm; 8 inch W 300mm[6] |
| Utilities | — | AC200V single phase 50/60Hz; 3.0KVA; Pressure 0.5Mpa; 300Nl/min using venturi valve[6] |
| Dimensions | — | D 1,200 W 1,646 H 1,800mm[6] |
| Weight | — | 850kg[6] |
| Options | — | ID reader; Barcode labeller[6] |
| Feature | — | Mounting minimum 150-micron thick and max 5 mm-warped wafers[7] |
| Vintage | — | 1998 Vintage[8] |
| Power & electrical | — | AC200V single phase 50/60Hz; 3.0KVA; Pressure 0.5Mpa; 300Nl/min using venturi valve[8] |
| Mounting minimum | — | 150-micron thick and max 5 mm-warped wafers[7] |
| Mounting capability | — | Minimum 150-micron thick and max 5 mm-warped wafers[7] |
| In line system | — | For pairing with TEAM-200[6] |
| Condition | — | Non-operational[5] |
| Vacuum chamber | — | Reduces damage from the lamination roller and prevents air bubbles[8] |
| Warpage handling | — | Warpage is corrected inside the vacuum chamber[8] |