Waferpedia

Comparison ledger

M Prep 3versus12 Benchtop Lapping Polishing

Allied High Tech M Prep 3, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
M Prep 3Allied High Tech
OEMAllied High TechLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAllied High Tech M Prep 3Lapmaster 12 Benchtop Lapping Polishing
Specifications
ConfigurationParts Unit[1]Ring lapper[6]
OEMAllied High Tech[1]—
ModelM Prep 3[1]12[3]
CategoryCMP[2]CMP[4]
Tool typeGrinder / Polisher[1]—
Wafer size8 inch[1]—
Make—Lapmaster[3]
Type/Application—Single sided[5]
Plate diameter—12 in[5]
No. of conditioning rings—3[6]
Base—Rigid, lightweight, cast aluminum base[6]
Standard RPM—60 RPM[6]
RPM range with variable speed drive—0-60[6]
Drive motor - lapper—0.5 HP[6]
Drive motor - polisher—0.75 HP[6]
Length—25 in[6]
Width—18 in[6]
Height—24 in[6]
Estimated shipping weight—240 lbs[6]
Approximate weight—135 lbs / 61 kg[7]
Approximate dimensions—24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[7]
Electrical system—Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[7]
Motor—1/3 hp / 0.25 kW motor with gear reducer[7]
Abrasive feed system—Designed for water or oil based lapping slurries[7]
Automatic cycle timer—Automatic digital cycle timer[7]
Ring configuration—Ring lapper[6]
Ring ID—4.25 inches[6]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]lapmaster-wolters.comlapmaster-wolters.com
  6. [6]catalog.lapmaster.comcatalog.lapmaster.com
  7. [7]lapmaster-wolters.comlapmaster-wolters.com