Waferpedia

Comparison ledger

G 5 Plusversus0020 12458 Part

Aixtron G 5 Plus, Applied Materials 0020 12458 Part, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
G 5 PlusAixtron
0020 12458 PartApplied Materials
OEMAixtronApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAixtron G 5 PlusApplied Materials 0020 12458 Part
Specifications
ConfigurationGaN Epitaxy 6"/8" Bridge[1]Insulator,Side Match,Hdp-Cvd Ultima Plus[4]
H2300slm[1]—
NH3100 slm[1]—
C2H45 slm[1]—
Cl23slm[1]—
Operating pressure inside systemmax. 6barg[1]—
Wafer sizes6, 8 inch[1]—
Operating pressure (max)6 barg[1]—
H2 flow (max)300 slm[1]—
NH3 flow (max)100 slm[1]—
SiH4/H2 (≤2%) flow5 slm[1]—
C2H4 flow5 slm[1]—
Cl2 flow3 slm[1]—
Reactor typePlanetary reactor module[2]—
Substrate sizes150 mm, 200 mm[2]—
Configurations8x150 mm, 5x200 mm[2]—
In-situ cleaningCl2 in-situ cleaning[2]—
Wafer handlercassette-to-cassette[2]—
Substrate typesSi, Sapphire, SiC[3]—
Process module voltage208 VAC[3]—
RF generator voltage480 VAC[3]—
ExhaustSingle filter exhaust CT500[3]—
Process pumpEbara ESA80[3]—
Mass flow controllersHoriba MFC's[3]—
Software versionAixact 7.1.2.8[3]—
InjectorPenta Injector[3]—
Control systemEpiTT version 1[3]—
Asset number—146526[4]
Make—Applied Materials[4]
Model—0020 12458[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]aixtron.comaixtron.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing