Comparison ledger
Accretech UF 300 A Automatic Wafer, Semics Opus 3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | UF 300 A Automatic WaferAccretech | Opus 3Semics |
|---|---|---|
| OEM | Accretech | Semics |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | 2001 Vintage | — |
| Control system | — | MS Windows XP Professional |
| Generation | — | — |
| Family | Accretech UF 300 | Semics Opus |
| Specifications | ||
| Configuration | Nickel chuck[2] | 15 A[1] |
| Phase | 1 Phase[2] | — |
| Cognex board type | 8200[3] | — |
| Voltage | 208V[3] | — |
| OEM | Accretech / TSK[2] | — |
| Model | UF 300 A[2] | — |
| Equipment type | Automatic Wafer Prober[2] | — |
| Wafer size | 8 inch[2] | — |
| Chuck | Nickel chuck[2] | — |
| Power | 1 Phase[2] | — |
| Vintage | 2001[2] | 2014, 2015, 2016, 2017 (observed units)[1] |
| Keyboard/joystick | Keyboard, joystick[3] | — |
| Storage | 3.5" floppy disk / 3.5" hard disk[3] | — |
| Printer | Internal printer[3] | — |
| Interfaces | GPIB I/F, RS232 I/F, Ethernet I/[3] | — |
| Functions | Probe mark inspection; automatic probe to pad alignment; multi-die probing up to 256 DUTs; multi function cleaning pad; automatic needle height alignment; soak time option; new E2 camera update[3] | — |
| Chuck Type | Nickel chuck (some units) or gold plated chuck (other units)[3] | — |
| Automation | Fully automatic[3] | — |
| Probe Card Change | Included[3] | — |
| User Interface | Keyboard, joystick, 3.5" floppy disk / hard disk, internal printer[3] | — |
| Vision System | Cognex board type 8200, New E2 camera update[3] | — |
| Probing Features | Multi-die probing up to 256 DUTs, automatic probe to pad alignment, probe mark inspection, automatic needle height alignment[3] | — |
| Cleaning | Multi function cleaning pad[3] | — |
| Soak Option | Soak time option[3] | — |
| Power Supply | — | 200-240 V[1] |
| Full Load Current | — | 11 A[1] |
| Max Ampere Rating | — | 25 A[6] |
| Interruption Capacity | — | 10 kA[6] |
| Power Supply Voltage | — | 200-240 V[1] |
| Power Supply Current | — | 15 A[1] |
| Power Supply Frequency | — | 50/60 Hz[1] |
| Wafer Sizes | — | 8 inch, 12 inch[5] |
| Hot Chuck | — | Included[5] |
| Communication Interface | — | GPIB[5] |
| Operating System | — | MS Windows XP Professional[5] |
| Type | — | Prober[1] |
| Communication | — | GBIP[5] |
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