Comparison ledger
YES 450PB, YES 8-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 450PBYES | 8-2P-CPYES |
|---|---|---|
| OEM | YES | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | YES 450PB | YES 8-2P-CP |
| Cited variants |
| |
| Specifications | ||
| Series type | MEMS high vacuum cure ovens[1] | — |
| Maximum process temperature | Up to 450°C[1] | — |
| High vacuum | 10-6[1] | — |
| Pressure range | 50-500 Torr[2] | — |
| Laminar flow pressure range | 0.50-500 Torr[2] | — |
| Process gases | Up to four process gases[2] | — |
| Cooling package | Air-only cooling package; no water[1] | uses air, no water[4] |
| Cassette construction | 316L SST welded, electro-polished construction with no screws or fasteners[3] | — |
| Cassette temperature suitability | 316L SST suitable up to 760°C; recommended continuous operating temperature without distortion is 500°C[3] | — |
| Cassette sizes | 25-wafer cassettes: 2 inch, 3 inch, 100mm, 125mm, 150mm, 150mm short, 200mm, 200mm short, 300mm, and 300mm load port; 13-wafer cassettes: 300 mm and 300mm load port[3] | — |
| Equipment type | High vacuum cure oven series[1] | — |
| Wafer size | 200 mm wafers[1] | 200 mm wafers[1] |
| Maximum operating temperature | up to 450°C[1] | — |
| Laminar flow | vertical laminar airflow[1] | — |
| High vacuum variant | YES-450PB-HV[1] | — |
| High vacuum level | 10-6 Torr[1] | — |
| Cassette material | 316L stainless steel, welded and electro-polished construction[3] | — |
| Model | — | 8-2P-CP[1] |
| Series | — | YES-PB Series[1] |
| Load type | — | manual load[4] |
| Process interface | — | touch screen interface enables the process to be fully automated[4] |
| Airflow | — | vertical laminar airflow[4] |
| Condensate control | — | coalescing condensate trap assembly[4] |
| Process type | — | manual-load high-temperature cure oven[4] |
| Applications | — | Polyimide/PBO cure; BCB bake; Low temp polymers cure; Copper anneal; Low-K dielectric cure; Copper oxide removal; Aluminum anneal[4] |
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