Waferpedia

Comparison ledger

1000PversusR1

YES 1000P, YES R1, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
R1YES
OEMYESYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle—Legacy
Lifecycle milestones1998 Acquisition—
Control system——
Generation——
FamilyYES 1000PYES R1
Cited variants—
Specifications
Model1000P[2]—
System typePlasma cleaning system[2]—
Shelf configurationFour 16 x 16 inch shelves[2]—
Total capacity1024 square inches[2]—
Control systemPLC driven with plain English real time process readout and diagnostics in the event of system abort[2]—
Number of shelves4[2]—
Shelf size16 x 16 inches[2]—
Power1000 W[3]—
ConfigurationParallel plate[3]—
Operation modesActive, RIE, Downstream[2]—
Sample size rangeFrom smallest semiconductor chip to large flat panels[2]Small pieces up to 12 in x 12 in x 4 in[5]
Plasma clean benchmark—5 minute Argon plasma clean[1]
Referenced use—Industry standard for 15 years[1]
Input power / rating—120 V, 60 Hz, 1.4 A, 175 W[4]
Controller—Y.E.S. ‘Lark’ Logical Sequencer[4]
Plasma power source—Plasma-Therm PE-1000, ~1 kW, ~50 kHz, 115 VAC[4]
Matching network—Advanced Energy LM-5K manual transformer[4]
Vacuum pump—Fisher Scientific Maxima C Plus Model M2C, KF-16 inlet[4]
Process gases—Ar or O2[5]
Chamber temperature range—25–80 °C (typical, from plasma heat)[5]
Maximum substrate size—12 inch[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]nfc.arizona.edunfc.arizona.edu
  5. [5]nnci.netnnci.net