Comparison ledger
West Bond 10490, West Bond 7476 D 79, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10490West Bond | 7476 D 79West Bond |
|---|---|---|
| OEM | West Bond | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | West Bond 10490 | West Bond 7476 |
| Specifications | ||
| Manufacturer | West Bond[1] | — |
| Model | 10490[1] | — |
| Description | Convertible bonder, wedge to ball[2] | — |
| Tool type | Convertible bonder[3] | — |
| Bonding modes | Wedge bonding and ball bonding[3] | — |
| Use | Wire bonding[3] | — |
| Configuration | — | Olympus SZ 51-60 Microscope[4] |
| Bonding technique | — | manual wedge-wedge wire bonding[5] |
| Minimum bond pad size | — | 50 µm[5] |
| Maximum bond sites before wire parting | — | 21[5] |
| Wire diameter range | — | 0.0007–0.002 inches (17.8–50.8 µm)[5] |
| Supported wire materials | — | aluminum and gold[5] |
| Current wire configuration | — | 0.00125-inch (31.75 µm) aluminum wire[5] |
| Ultrasonic frequency | — | approximately 63 kHz[5] |
| Aluminum wire bonding temperature | — | room temperature[5] |
| Gold wire bonding method | — | heated-stage thermosonic bonding[5] |
| Microscope | — | Olympus SZ 51-60[4] |
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