Waferpedia

Comparison ledger

MA 200 Gen 3 Maskversus1000 Family

SUSS MicroTec MA 200 Gen 3 Mask, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MA 200 Gen 3 MaskSUSS MicroTec
1000 FamilyUltratech
OEMSUSS MicroTecUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec MA 200Ultratech 1000 Family
Cited variants
  • MA 200 Gen 3 (6")Gen 3[1]
  • MA 200 Gen 3 (8" Compact)Gen 3[2]
  • MA 200 Gen 3 (8" Complete PC)Gen 3[3]
—
Specifications
Phase3 Phase + N + PE[1]—
Configuration25A[1]—
Power5.5kVA[1]—
Voltage400V~[1]—
Maximum wafer sizeup to 8" / 200 mm[4]—
Wafer size (6" configuration)6 inch[1]—
Wafer size (8" configuration)8 inch[2]—
Operation typeAutomatic[4]—
Electrical supply (6" configuration)3 Phase + N + PE - 25A - 5.5kVA - 50/60 Hz - 400V~[1]—
Electrical supply (8" compact configuration)3 Phase + N + PE - 50/60 Hz[2]—
Hard disk and software (compact)with HDD and Software[2]—
Complete PC and HDDComplete PC - HDD[3]—
BSA optionBSA Option included[3]—
DirectAlign optionDirectAlign Option included[3]—
Equipment typeMask Aligner[1]—
Wafer sizes6 inch[1]—
Wafer size capabilityup to 8"/200 mm[4]—
AutomationAutomatic mask aligner[4]—
Tool type—Photolithography step-and-repeat 1X stepper[5]
Optical design—Wynne Dyson[5]
Magnification—1X[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]web.archive.orgweb.archive.org
  5. [5]en.wikipedia.orgen.wikipedia.org