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Comparison ledger

100R16versusPA 300 Control

Strasbaugh 100R16, SUSS MicroTec PA 300 Control, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100R16Strasbaugh
PA 300 ControlSUSS MicroTec
OEMStrasbaughSUSS MicroTec
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyStrasbaugh 100R16SUSS MicroTec PA 300
Specifications
type1 spindle grinder/polisher[1]—
drive systemDC drive system with 2 motors[1]—
spindle RPM1-180 RPM[1]—
eccentric RPM1-90 RPM[1]—
controlsdigital timer; air down switch; spindle and eccentric speed dials; air regulators[1]—
capacity16 inches[1]—
spindle size1-8 TPI[1]—
overall dimensions28 inches x 36 inches x 48 inches[1]—
weight500 lbs[1]—
originmade in the USA[1]—
Configuration—500 VA, 115V, 60Hz[2]
Category—CMP[3]
Power—500 VA, 115V, 60Hz[2]
Wafer handling—12" Nickel Plated Aluminum Chuck[2]
Control & software—ATT M300 Temp Control Unit[3]
Optics—10X, 2X Mitutoyo Plan Apo Objective, 2ea[2]
Configuration & options—Cascade CMPS-888 Microscope; Suss PH150 Micropositioner, 4ea[2]
Chuck—12-inch nickel plated aluminum chuck[2]
Control unit—ATT M300 Temp Control Unit[3]
Microscope—Cascade CMPS-888 Microscope[2]
Micropositioners—Suss PH150 Micropositioner, 4ea[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]excelltechnology.comexcelltechnology.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com