Waferpedia

Comparison ledger

UTC 3000 WEversus10100

Shinkawa UTC 3000 WE, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
UTC 3000 WEShinkawa
10100West Bond
OEMShinkawaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyShinkawa UTC 3000 WEWest Bond 10100
Specifications
Wafer size8 inch[1]—
Vintage2012[1]—

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing