Waferpedia

Comparison ledger

ACB 1000versus10490

Shinkawa ACB 1000, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACB 1000Shinkawa
10490West Bond
OEMShinkawaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyShinkawa ACB 1000West Bond 10490
Specifications
OEMShinkawa[1]—
ModelACB 1000[1]10490[2]
Tool typeWire Bonder[1]Convertible bonder[4]
Vintage2010[1]—
Manufacturer—West Bond[2]
Description—Convertible bonder, wedge to ball[3]
Bonding modes—Wedge bonding and ball bonding[4]
Use—Wire bonding[4]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]waferpedia.comwaferpedia.com