Waferpedia

Comparison ledger

1500versus100R16

PR Hoffman 1500, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1500PR Hoffman
100R16Strasbaugh
OEMPR HoffmanStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPR Hoffman 1500Strasbaugh 100R16
Specifications
Model85T[1]—
TypeDouble-sided planetary lapping / polishing machine[1]—
Diameter19 inch[1]—
Motor1.5 horsepower variable speed DC motor with controller[1]—
Controller input208/230V, 50/60 Hz[1]—
Carrier85 tooth carrier[1]—
Recommended part thickness minimum0.010 inch [250 micron][1]—
Recommended part diameter maximum4-1/4 inch [108 mm] or smaller[1]—
Maximum part circle6.6 inch [168 mm][1]—
Stainless steel hoodStandard on all PR-1 models[2]—
Plate lifterStandard on the 85 tooth model[2]—
type—1 spindle grinder/polisher[3]
drive system—DC drive system with 2 motors[3]
spindle RPM—1-180 RPM[3]
eccentric RPM—1-90 RPM[3]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[3]
capacity—16 inches[3]
spindle size—1-8 TPI[3]
overall dimensions—28 inches x 36 inches x 48 inches[3]
weight—500 lbs[3]
origin—made in the USA[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]excelltechnology.comexcelltechnology.com