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Comparison ledger

SLR 770 ICP Deep Siliconversus1512e

Plasma-Therm SLR 770 ICP Deep Silicon, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMPlasma-ThermTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPlasma-Therm SLR 770Tegal 1512e
Specifications
ConfigurationLoad lock shuttle lock transfer[1]—
Process GasO2, Ar, SF6, C4F6[1]—
ChillerNeslab HX300[1]—
Power BoxSquare D[1]—
ManufacturerPlasma-Therm[1]—
ModelSLR 770[1]—
CategoryEtch[1]—
Wafer sizes4 inch[1]—
Tool typeSingle-chamber inductively coupled plasma etcher[2]Industrial RIE plasma etcher system[4]
Wafer handlingLoad lock shuttle lock transfer[1]—
Load lockSingle wafer semi-auto load lock[3]—
ApplicationDeep silicon etch[3]—
Gas boxHoriba SEC-E40 (4)[1]—
Process gasesO2, Ar, SF6, C4F6[1]—
Controller and RF generatorRF Power Products RFPP I22050001 & I20050007[1]—
Adaptive pressure controllerVAT PM-5[1]—
Heater controllerPlasmatherm PC OS[1]—
RF generatorRF Power Products RFPP RF5S & AM-5[1]—
Turbo pump and controllerLeybold MAG 2000; Leybold MD 2000[1]—
Vintage01.06.1998[3]—
Power1.0 kW ICP RF package; 2 kW generator limited to 1.0 kW; 500 W RF bias[3]—
Gas box lines5 lines[3]—
Additional process gasesCHF3, C4F8, SF6, Ar, O2[3]—
Dry pumpEdwards ih80[3]—
Load lock dry pumpEdwards nxds[3]—
Load lock turbo pumpLeybold[3]—
Turbo pumpEdwards STPA-1303CV[3]—
Electrical380VAC 3 phase[3]—
Stated configuration—With modules assembly for CI-4222[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]fabsurplus.comfabsurplus.com
  4. [4]semistarcorp.comsemistarcorp.com