Waferpedia

Comparison ledger

3500 II CEversus10490

Palomar 3500 II CE, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3500 II CEPalomar
10490West Bond
OEMPalomarWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPalomar 3500 II CEWest Bond 10490
Specifications
ManufacturerPalomar[1]West Bond[3]
Model3500 II CE[1]10490[3]
Equipment typeBonder[1]—
CategoryPackaging & Bonding[2]—
Research statusNo specifications recorded yet[2]—
Description—Convertible bonder, wedge to ball[4]
Tool type—Convertible bonder[5]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com