Comparison ledger
Oxford Instruments 100 ICP Fluorine, Pfeiffer Alcatel 601 E DRIE, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100 ICP FluorineOxford Instruments | Alcatel 601 E DRIEPfeiffer |
|---|---|---|
| OEM | Oxford Instruments | Pfeiffer |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments 100 ICP Fluorine | Pfeiffer Alcatel |
| Specifications | ||
| Etch Gases | SF6, CF4, O2, Ar, N2, CHF3, C4F8[1] | — |
| Cryo DRIE etch rate | up to 5 µm/min[1] | — |
| Wafer size | 4 inch, 6 inch, 8 inch (with clamp change)[1] | — |
| Configuration | — | With:[2] |
| Type | — | Deep Reactive Ion Etch system[3] |
| Category | — | Etch[3] |
| Model | — | 601 E[2] |
| Make | — | Pfeiffer / Alcatel[2] |
| Power | — | Advanced Energy RF-F2[3] |
| Vacuum | — | VAT Adaptive Pressure Controller[3] |
| Configuration / options | — | Alcatel ACT 1300 M[2] |
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