Waferpedia

Comparison ledger

DSS 200 Series II Waferversus11600 SRD

Ontrak DSS 200 Series II Wafer, Semitool 11600 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11600 SRDSemitool
OEMOntrakSemitool
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2023 Introduced—
Control system——
Generation——
FamilyOntrak DSS 200Semitool 11600 SRD
Specifications
ConfigurationPost CMP[1]Ceramic[3]
MakeOntrak[1]—
ModelDSS 200 Series II Wafer[1]11600 SRD[3]
Equipment typeWafer Scrubber[1]Spin Rinse Dryer[3]
Wafer sizes6 inch[1]—
Tool descriptionpost-CMP semiconductor process tool[2]—
Applicationcleaning wafers after chemical mechanical polishing[2]—
Wafer size8 inch[2]—
Tool typeWafer Scrubber[1]—
Process usePost CMP[1]—
Introduced2023[2]—
Power200 / 208 / 220 VAC[2]—
Frequency50/60 Hz[2]—
Breaker25 A (5.2 kW)[2]—
Total FLA6.8 A (1.4 kW)[2]—
CDA inlet pressure80-100 PSI[2]—
DI water inlet pressure60-80 PSI[2]—
Process solutions / chems inlet pressure15 PSI[2]—
Noise level during process70 dB[2]—
Manufacturer—Semitool[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing