Comparison ledger
OAI 200, SUSS MicroTec MA 200 Gen 3 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200OAI | MA 200 Gen 3 MaskSUSS MicroTec |
|---|---|---|
| OEM | OAI | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | OAI 200 | SUSS MicroTec MA 200 |
| Cited variants | — | |
| Specifications | ||
| OEM | OAI[5] | — |
| Model | 200[5] | — |
| Tool owner | Brian Baker[5] | — |
| Serial number | 1213[5] | — |
| Location | Bay B[6] | — |
| Substrate size accommodation | up to 6"x6"[7] | — |
| Mask size accommodation | 2"x2" to 7"x7"[7] | — |
| Maximum mask size (datasheet) | up to 9"x9"[8] | — |
| Alignment precision | 1 micron[9] | — |
| Vacuum Chuck X, Y travel | ±0.47" (12mm)[7] | — |
| Vacuum Chuck Z travel | ±0.12" (3mm)[7] | — |
| Vacuum Chuck rotation | ±7°[7] | — |
| Substrate Stage X, Y travel (datasheet) | ±10mm[8] | — |
| Z travel (datasheet) | 1500 microns[8] | — |
| Rotation (datasheet) | ±3.5°[8] | — |
| Lamp power range | 200W to 2000W[9] | — |
| UV wavelength range | Near or Deep UV (220nm to 436nm)[7] | — |
| Exposure intensity control | ±2% of desired intensity[9] | — |
| Timer range | 0-1000 seconds in 1 second intervals[7] | — |
| Dimensions (width) | 31 inches[7] | — |
| Dimensions (height) | 37 inches (datasheet: 37")[8] | — |
| Weight | 250 lbs[8] | — |
| Phase | — | 3 Phase + N + PE[2] |
| Configuration | — | 25A[2] |
| Power | — | 5.5kVA[2] |
| Voltage | — | 400V~[2] |
| Maximum wafer size | — | up to 8" / 200 mm[1] |
| Wafer size (6" configuration) | — | 6 inch[2] |
| Wafer size (8" configuration) | — | 8 inch[3] |
| Operation type | — | Automatic[1] |
| Electrical supply (6" configuration) | — | 3 Phase + N + PE - 25A - 5.5kVA - 50/60 Hz - 400V~[2] |
| Electrical supply (8" compact configuration) | — | 3 Phase + N + PE - 50/60 Hz[3] |
| Hard disk and software (compact) | — | with HDD and Software[3] |
| Complete PC and HDD | — | Complete PC - HDD[4] |
| BSA option | — | BSA Option included[4] |
| DirectAlign option | — | DirectAlign Option included[4] |
| Equipment type | — | Mask Aligner[2] |
| Wafer sizes | — | 6 inch[2] |
| Wafer size capability | — | up to 8"/200 mm[1] |
| Automation | — | Automatic mask aligner[1] |
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