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Comparison ledger

3290versus3290 STQ

Novellus 3290, Novellus 3290 STQ, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3290Novellus
3290 STQNovellus
OEMNovellusNovellus
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNovellus 3290Novellus 3290
Cited variants
  • Novellus / Varian 3290 STQ[1]
—
Specifications
ConfigurationECS 3000 or MST 3000[2]Recent model control system[4]
Process typePVD sputter physical vapor deposition[2]—
Wafer size6 inch[2]—
Configuration optionsECS 3000 or MST 3000[3]—
Phase—3 Phase[4]
Frequency—50 Hz[4]
DC Power Supply—12 / 12 / 12 kW, 208 V[4]
Load Lock Pump—Varian V 70 Turbo Pump[4]
Wafer Size—6 inch[5]
Power Supply Phase/Frequency—3 Phase, 50 Hz[4]
Optional DC Power Supply—6 / 6 / 12 kW, 208 V (option for 12 /12 / 12 kW AE Pinnacle at 400 V)[4]
Control System—Recent model control system with touch screen from both sides[4]
Temperature Controller—Latest version[4]
Cryo Pumps—CTI Cryo Pumps[4]
Water Pumps—Included[4]
Mass Flow Controllers—Upgrade to MFC vs. needle valve[4]
Pressure Controller—New[4]
Preheating—Installed Heater for Preheating (no RF Etch Position)[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inventory listing
  5. [5]Equipment inventory listing