Waferpedia

Comparison ledger

15versusDS 271

Lapmaster 15, Meyer Burger DS 271, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
DS 271Meyer Burger
OEMLapmasterMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2010 Stated vintage
Control system——
Generation——
FamilyLapmaster 15Meyer Burger DS 271
Cited variants—
Specifications
Input Power110 Vac[2]—
Plate Diameter15 inches (381 mm)[3]—
Number of Conditioning Rings3[3]—
Ring ID5.5 inches (140 mm)[3]—
Standard RPM60[3]—
RPM Range (Variable Speed Drive)0-60[3]—
Drive Motor - Lapper0.5 HP (0.37 kW)[3]—
Drive Motor - Polisher0.75 HP (0.56 kW)[3]—
Length25 inches (635 mm)[3]1061 mm[4]
Width20 inches (508 mm)[3]—
Height24 inches (610 mm)[3]—
Estimated Shipping Weight285 lbs (129.3 kg)[3]—
Configuration—With HDD & Software[4]
Diameter—350 mm[4]
Weight—175 kg[4]
Number—2[4]
Required power—2 x 75 kW[4]
Bearing application—special roller bearings, water-cooled[4]
Horizontal distance between axes—660 mm[4]
Wire web working height—1515 mm[4]
Wire web width—1030 mm[4]
Loading length—1020 mm[5]
Max workpiece dimensions—220 x 220 mm[5]
Workpiece holders—4 x 255 mm, 3 x 340 mm, 2 x 510 mm, 1 x 1020 mm[5]
Wire diameter—100–160 micron[5]
Wire speed—15 m/sec[5]
Wire guide rolls diameter—350 mm[5]
Diamond wire upgrade—Water based upgrade installed[6]
Vintage—2010/2011[5]
Wire guide roller diameter—350 mm[4]
Wire guide roller length—1061 mm[4]
Wire guide roller weight—175 kg[4]
Wire guide roller count—2[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]web.archive.orgweb.archive.org
  4. [4]inventory listing
  5. [5]tradekorea.comtradekorea.com
  6. [6]tradeindia.comtradeindia.com