Comparison ledger
Lapmaster 15, Meyer Burger DS 266, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | DS 266Meyer Burger |
|---|---|---|
| OEM | Lapmaster | Meyer Burger |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 15 | Meyer Burger DS 266 |
| Specifications | ||
| Input Power | 110 Vac[1] | — |
| Plate Diameter | 15 inches (381 mm)[2] | — |
| Number of Conditioning Rings | 3[2] | — |
| Ring ID | 5.5 inches (140 mm)[2] | — |
| Standard RPM | 60[2] | — |
| RPM Range (Variable Speed Drive) | 0-60[2] | — |
| Drive Motor - Lapper | 0.5 HP (0.37 kW)[2] | — |
| Drive Motor - Polisher | 0.75 HP (0.56 kW)[2] | — |
| Length | 25 inches (635 mm)[2] | — |
| Width | 20 inches (508 mm)[2] | — |
| Height | 24 inches (610 mm)[2] | — |
| Estimated Shipping Weight | 285 lbs (129.3 kg)[2] | — |
| Voltage | — | 400V[3] |
| Configuration | — | 120A[3] |
| Frequency | — | 50 Hz[3] |
| Current | — | 120 A[3] |
| Vintage | — | 2008[3] |
| Wafer Size | — | 8 inch[4] |
| Includes HDD & Software | — | Yes[4] |
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