Waferpedia

Comparison ledger

15 Lapperversus1500

Lapmaster 15 Lapper, PR Hoffman 1500, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15 LapperLapmaster
1500PR Hoffman
OEMLapmasterPR Hoffman
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLapmaster 15PR Hoffman 1500
Specifications
Number Of Conditioning RingsUp to 3[1]—
Ring IDUp to 5.5″[1]—
Plate Diameter – Outside15″[1]—
Plate Diameter – Inside3 1/2″[1]—
Standard RPM60[1]—
Drive Motor1/2 HP[1]—
Electrics110V / 1Ph / 60Hz[1]—
Dimensions – Approximate26″(L-R) x 21″(F-B) x 22″(H)[1]—
ConfigurationEquipped with:[1]—
Equipped with: 15″ Cast Iron PlateIncluded[1]—
Equipped with: (3) Yoke/Roller Bearing AssembliesIncluded[1]—
Equipped with: (3) Conditioning RingsIncluded[1]—
Equipped with: (3) Hold DownsIncluded[1]—
Equipped with: 30 Minute TimerIncluded[1]—
Model—85T[2]
Type—Double-sided planetary lapping / polishing machine[2]
Diameter—19 inch[2]
Motor—1.5 horsepower variable speed DC motor with controller[2]
Controller input—208/230V, 50/60 Hz[2]
Carrier—85 tooth carrier[2]
Recommended part thickness minimum—0.010 inch [250 micron][2]
Recommended part diameter maximum—4-1/4 inch [108 mm] or smaller[2]
Maximum part circle—6.6 inch [168 mm][2]
Stainless steel hood—Standard on all PR-1 models[3]
Plate lifter—Standard on the 85 tooth model[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]web.archive.orgweb.archive.org