Waferpedia

Comparison ledger

SEZ 201 Backsideversus100 ICP Fluorine

Lam Research SEZ 201 Backside, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
SEZ 201 BacksideLam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research SEZOxford Instruments 100 ICP Fluorine
Specifications
Configuration2 SM[1]—
MakeLam / SEZ[1]—
Model201[1]—
Wafer size8 inch[1]4 inch, 6 inch, 8 inch (with clamp change)[2]
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[2]
Cryo DRIE etch rate—up to 5 µm/min[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu