Waferpedia

Comparison ledger

Gasonics L 3300versus211

Lam Research Gasonics L 3300, TEGAL 211, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Gasonics L 3300Lam Research
211TEGAL
OEMLam ResearchTEGAL
CategoryResist ProcessingResist Processing
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research GasonicsTEGAL 211
Specifications
ConfigurationParts machine[1]—
Wafer size6 inch[1]—
Part typeParts machine[2]—
Refurbished RTP RTA—AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[3]
KLA-Tencor Spare Parts and Service—RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[3]
Refurbished Isotropic Plasma Etcher—Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[3]
Refurbished PECVD, ALD Equipment—Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[3]
Refurbished Mask Aligner—Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[3]
Refurbished Bonding—SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[3]
Refurbished Wafer Prober—Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[3]
Process Type—Plasma Asher/Etcher[4]
Wafer Size (max)—3 inch[4]
Form Factor—Table top[4]
Chamber Material—Aluminum[3]
Chamber Internal Dimensions—6 x 6 x 3.75 inches[3]
Timer Range—0-99 minutes[4]

Plan your fab

Building a Resist Processing process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]dealer listingsemistarcorp.com
  4. [4]jmind.comjmind.com