Waferpedia

Comparison ledger

Nano36versus11600 SRD

Kurt Lesker Nano36, Semitool 11600 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Nano36Kurt Lesker
11600 SRDSemitool
OEMKurt LeskerSemitool
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKurt Lesker Nano36Semitool 11600 SRD
Specifications
OEMKurt J Lesker[1]—
ModelNano36 Thermal Deposition System[1]11600 SRD[3]
Equipment typeCleanroom Instrumentation[1]Spin Rinse Dryer[3]
Process categoryThin Film Fabrication[1]—
LocationFNT 4.106[1]—
Equipment TypeCleanroom Instrumentation; Thin Film Fabrication[2]—
Deposition typethermal deposition of metals[2]—
Substrate sizeup to 150 mm in diameter[2]—
Automated process controlKJL eKLipse software with a graphical recipe builder[2]—
Deposition sourcestwo thermal sources for co-deposition and four sources for sequential deposition[2]—
Source characteristicsDC power supply rated up to 12 V or 400 A; maximum applied power 2 kW[2]—
Shutters and shieldingsubstrate and source shutters with cross-contamination shields[2]—
Substrate rotationup to 20 rpm[2]—
Thickness monitoringtwo crystal sensors with controller-based deposition rate and film thickness control[2]—
System base pressure5.0 × 10^-6 Torr[2]—
Film uniformity<8%[2]—
Configuration—Ceramic[3]
Manufacturer—Semitool[3]

Plan your fab

Building a Wet Processing / Clean process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]tmi.utexas.edutmi.utexas.edu
  3. [3]inventory listing