Waferpedia

Comparison ledger

M 712 M 711 Dry Etch Processversus1512e

Hitachi M 712 M 711 Dry Etch Process, Tegal 1512e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1512eTegal
OEMHitachiTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi M 712 M 711 Dry Etch ProcessTegal 1512e
Cited variants
  • M 712 / M 711[1]
—
Specifications
Software revision1.07 PMv.02.16M[2]—
ConfigurationGaspanel included[2]—
ESC TypeBipolar[1]—
Endpoint typeHitachi EPD monitor ePMv02.16M[1]—
Wafer size12 inch[2]—
TMPSHIMAZU EC TMP[1]—
TMP controller3203LMC-K1 EC TMP Controller[1]—
Source generatorDAIHEN ES7-IIA EC Source generator[1]—
Bias generatorPEARL CF-500-400K EC Bias generator[1]—
Gas configurationLine / EC1 / Strip - 1 / Ar - 2 / C12 - 3 / SF6 - 4 / HBr - 5 / CF3 - 6 / CH4 - 7 / NF3 - 8 / O2 - 9 / N2 - 10/ SF6 - 11/ C12 - 12/ O2[1]—
Gas panel includedYes[2]—
Vintage2006[2]—
Tool type—Industrial RIE plasma etcher system[3]
Stated configuration—With modules assembly for CI-4222[3]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com