Waferpedia

Comparison ledger

DM 421 Pversus100 ICP Fluorine

Hitachi DM 421 P, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DM 421 PHitachi
100 ICP FluorineOxford Instruments
OEMHitachiOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi DM 421 POxford Instruments 100 ICP Fluorine
Specifications
Wafer Size8 inch[1]—
Vintage1995[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[2]
Cryo DRIE etch rate—up to 5 µm/min[2]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]nanofab.utah.edunanofab.utah.edu