Waferpedia

Comparison ledger

1305 BSG 3versusR3A

Hitachi 1305 BSG 3, YES R3A, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
R3AYES
OEMHitachiYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi 1305 BSG 3YES R3A
Specifications
Model designation—Glen/YES R3A[1]
Alternate designation—YES-R3[1]
Series—R-Series plasma cleaning systems[1]
Position in series—smallest of the series[1]
Intended use—designed for pilot run quantities[1]
Sample trays—two 14 x 14 inch sample trays[1]
Total capacity—390 square inches[1]
Power—500W[2]
Frequency—40kHz (low-frequency)[2]
Platen/Chamber Size—14 x 14-inch, two-shelf configuration[2]
Operational Modes—Active Plasma, RIE, Downstream[2]
Process Type—Batch-process, low-frequency plasma cleaning[2]
Primary Application—Surface treatment including photoresist stripping (not primary use in Protofab)[2]

Plan your fab

Building a Wet Processing / Clean process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]protowiki.oasis.ucsb.eduprotowiki.oasis.ucsb.edu