Comparison ledger
Hitachi 1305 BSG 3, Tokyo Electron Expedius, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | ExpediusTokyo Electron |
|---|---|---|
| OEM | Hitachi | Tokyo Electron |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | Tokyo Electron Expedius |
| Specifications | ||
| Configuration | — | single block[1] |
| Wafer size capability | — | 5 to 8 inches[2] |
| Platform | — | CLEAN TRACK MARK 7[2] |
| Cleaning capability | — | Both sides of wafer[2] |
| Transfer system | — | Vacuumless robotic transport[2] |
| Chuck type | — | Mechanical and vacuum chucks[2] |
| Brush pressure control | — | Automatic brush pressure controller[2] |
| Optional cleaning modules | — | High-pressure jet spray or megasonic clean[2] |
| Host communication | — | GEM host communication[2] |
| Interface | — | SMIF interface[2] |
| Compliance | — | S2-93 and CE mark[2] |
| OEM | — | Tokyo Electron[1] |
| Model | — | Expedius[1] |
| Equipment type | — | Wet Bench[1] |
| Wafer capability | — | 5 inch to 8 inch[2] |
| Wafer transfer | — | non-vacuum wafer transfer capability[2] |
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