Waferpedia

Comparison ledger

PWM30versus0332 F 9453 302 Diffusion

Headway PWM30, Varian 0332 F 9453 302 Diffusion, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
PWM30Headway
OEMHeadwayVarian
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeadway PWM30Varian 0332 F 9453 302 Diffusion
Specifications
TypePhotoresist spin/bake hood[1]—
Spin speed50-10,000 RPM[1]—
ControlMicroprocessor controlled[1]—
Recipe stepsSupports up to nine steps in one recipe[1]—
Recipe storageStores up to 10 user-designed recipes[1]—
User interfaceLCD interface for user input prompts and process display[1]—
Substrate supportVacuum hold down chucks for alternate substrate sizes[1]—
SafetyFail-safe vacuum interlocks[1]—
ExhaustBowl exhaust[1]—
BowlRemovable bowl liners[1]—
BrakingAutomatic dynamic breaking[1]—
Asset Number—142841[2]
Last Confirm Date—October 14, 2025[3]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]nanocenter.umd.edunanocenter.umd.edu
  2. [2]Equipment inventory listing
  3. [3]fab-spares.comfab-spares.com