Waferpedia

Comparison ledger

8500 Waferversus1000 Family

GCA 8500 Wafer, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1000 FamilyUltratech
OEMGCAUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyGCA 8500 WaferUltratech 1000 Family
Specifications
Configuration5 Axis[1]—
Equipment typeCommercial wafer stepper[2]—
OEMGCA[1]—
Reduction ratio5x[1]—
Exposure sourcei-line[2]—
Resolution capabilitySub-micron features[3]—
Axis configuration5-axis[1]—
Wafer diameter150 mm[2]—
Wafer geometry supported1-flat, 2-flat, notched, no-flat[2]—
Wafer materials supportedSilicon, silicon on insulator[2]—
Wafer thickness range500–700 µm[2]—
Batch size1 wafer (150 mm)[2]—
Demonstrated wafer use6-inch silicon-on-insulator wafer[3]—
Tool type—Photolithography step-and-repeat 1X stepper[4]
Optical design—Wynne Dyson[4]
Magnification—1X[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]mems-exchange.orgmems-exchange.org
  3. [3]journals.plos.orgjournals.plos.org
  4. [4]en.wikipedia.orgen.wikipedia.org