Comparison ledger
F&K Delvotec G 5, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | G 5F&K Delvotec | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | F&K Delvotec | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | F&K Delvotec G 5 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | 45° or 90° Bondhead[1] | — |
| Equipment type | Wire bonder[1] | — |
| Bondhead | 45° or 90° bondhead[1] | — |
| Condition | Refurbished[1] | — |
| Vintage | 2014[1] | — |
| Wire diameter | 25 µm wire[2] | — |
| Bondhead type | Ball/wedge bondhead[2] | — |
| Power | 100-120 / 200-240 V, 0.6 kVA[2] | — |
| Phase | 50/60 Hz, Phase 5, 2.5 A[2] | — |
| Transducer | 120 kHz[2] | — |
| Vacuum | Vacuum based[2] | — |
| Minimum pad size | PCB 70 µm minimum pad size[2] | — |
| Angle | 90 degrees[2] | — |
| Wafer Size | — | 6 inch[3] |
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