Comparison ledger
EV Group 6200 NT, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 6200 NTEV Group | 150 e MaskSUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 6200 NT | SUSS MicroTec 150 e Mask |
| Cited variants |
| — |
| Specifications | ||
| Voltage | 200V[2] | — |
| Manufacturer | EV Group[3] | — |
| Model | 6200 NT[3] | — |
| Tool type | Bond Aligner[3] | — |
| Configuration | Semi-automated or automated[1] | — |
| Wafer/substrate size | Up to 200 mm / 8 in[1] | — |
| Exposure source | Mercury light source / UV LED light source[1] | — |
| Exposure source options | Mercury lamp or UV LED lamp source[4] | — |
| Alignment accuracy | Top side alignment: ≤ ±0.5 µm; bottom side alignment: ≤ ±1.0 µm; IR alignment: ≤ ±2.0 µm; bond alignment: ≤ ±2.0 µm; NIL alignment: ≤ ±3.0 µm[1] | — |
| Throughput | Up to 180 WPH in first print mode; up to 140 WPH in automatic alignment mode[1] | — |
| Exposure modes | Vacuum contact / hard contact / soft contact / proximity / curved surface[5] | — |
| System control | Windows-based[5] | — |
| Multi-language user GUI and support | CN, DE, FR, IT, JP, KR[1] | — |
| Additional capabilities | Bond alignment, IR alignment, Nanoimprint lithography (NIL), SmartNIL[1] | — |
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