Waferpedia

Comparison ledger

101versus661 HT

EV Group 101, SVG 661 HT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMEV GroupSVG
CategoryLithographyLithography
Wafer size—Mask / Wafer Handling:
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101SVG 661 HT
Specifications
OEMEV Group[1]SVG[4]
Model101[1]661 HT[4]
Equipment nameEVG 101 Spray Coater[1]—
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]—
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Configuration—Refurbished in 2022[4]
Process—Photo Exposure[4]
Heat Exchanger / Chiller—Blower[4]
Wafer size—Mask / Wafer Handling:[4]
Equipment type—Aligner[4]
Category—Lithography[5]
Optics—High Throughput Coated Optics (HT)[4]
Performance—Integrated Uniformity Tester[4]
Software—OS 2000 Hardware and Software v29.x or Higher[4]
Host link—SEMI-GEM E 30 & HSMS # 37 Compliant Host Link[4]
Chamber Type—M 500 / 600[4]
Cassette Stage—150 mm no smf[4]
Wafer Mapping—Optical Sensor[4]
Control System—OS 2000[4]
Air Cooler—39,000 BTU 220 Vac 3 Ф[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com