Waferpedia

Comparison ledger

101versusMA 200 Mask

EV Group 101, SUSS MicroTec MA 200 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
MA 200 MaskSUSS MicroTec
OEMEV GroupSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 101SUSS MicroTec MA 200
Specifications
OEMEV Group[1]SUSS[4]
Model101[1]MA 200[4]
Equipment nameEVG 101 Spray Coater[1]—
NEMO IDevgspraycoat[1]—
Training requiredEVG 101 Training[1]—
Training duration1.50 hours[1]—
Processing techniqueResist Spray Coat (manual)[1]—
Cleanliness"All"[1]—
LocationSNF Paul G Allen L107 Cleanroom[1]—
Wafer diameter (substrate size)up to 300 mm[2]—
Available modulesSpin coat / OmniSpray® / develop[2]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[2]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2]—
Processing technique (at SNF)Resist Spray Coat (manual)[3]—
Cleanliness group (at SNF)"All"[1]—
Configuration—With CIC1000 lamp housing[4]
Hardware—Intel Standard[4]
Operation—Semi-automatic[4]
Wafer sizes—6 inch, 8 inch[4]
Optics—UV400/cont/W-200[4]
Sensor—365/405 dual range[4]
Lamp housing—CIC1000[4]
Computer hardware—Intel Standard[4]
Alignment system—SUSS AL3000 Auto Align[4]
Microscope—DVM8 with Sony cameras, L25X Objective (qty 2)[4]
Mask holder—with Guard[4]
Field Expanders—Yes[4]
Wafer sizes (from other listing)—6, 8 inch[5]
Equipment type—Mask Aligner[4]
Wafer size—8 inch[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edusnfguide.stanford.edu
  2. [2]evgroup.comevgroup.com
  3. [3]snfguide.stanford.edusnfguide.stanford.edu
  4. [4]inventory listing
  5. [5]Equipment inventory listing