Comparison ledger
Disco DFL7340-stealth-dicer, SUSS MicroTec XB8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | XB8SUSS MicroTec | |
|---|---|---|
| OEM | Disco | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL7340-stealth-dicer | SUSS MicroTec XB8 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | DFL7340[1] | — |
| Process area | Packaging[1] | — |
| Compatible materials | Dedicated to dicing Si wafers only[1] | — |
| Laser engine wavelength | λ = 1342 nm[1] | — |
| Maximum sample diameter | 200 mm[1] | — |
| Dicing orientation | Topside or backside (through tape) dicing possible[1] | — |
| Si resistivity requirement | ρ > 0.01 Ω•cm[1] | — |
| Surface roughness requirement | Dicing streets must be smooth (mirror polish) on the surface where the laser is incident[1] | — |
| Street clearance requirement | Wafer must be metal-free in a width 0.4 × substrate thickness, centred on the dicing street[1] | — |
| Wafer size (max) | — | 200 mm[2] |
| Automation | — | Semi-automated[2] |
| Process | — | High-Force Wafer Bonding[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →