Waferpedia

Comparison ledger

DAG 810 Automaticversus15

Disco DAG 810 Automatic, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DAG 810Lapmaster 15
Cited variants
  • DAG 810 with Taiko Option[1]
—
Specifications
ConfigurationTaiko Option[1]—
Voltage100 V[1]—
Phase3 Phase[1]—
Full Load Current10 A[1]—
Largest Load3 A[1]—
Interrupting Capacity14 kA[1]—
Spindle rated power4.2 kW[2]—
Rated torque5.9 N·m[2]—
Speed range1,000 to 7,000 min⁻¹[2]—
Wafer Sizes8 inch[2]—
Vintage2016[2]—
Frequency50/60 Hz[1]—
Wiring3 Wire + Ground[2]—
Control SystemOriginal control system and safety guard, touchscreen interface[2]—
OEMDisco[3]—
ModelDAG 810[3]—
Machine typeAutomatic Grinder[3]—
OptionTaiko Option[1]—
Power supply100 V, 3 phase, 50/60 Hz[1]—
Control systemOriginal control system[2]—
Safety guardOriginal safety guard[2]—
InterfaceTouchscreen interface[2]—
Input Power—110 Vac[4]
Plate Diameter—15 inches (381 mm)[5]
Number of Conditioning Rings—3[5]
Ring ID—5.5 inches (140 mm)[5]
Standard RPM—60[5]
RPM Range (Variable Speed Drive)—0-60[5]
Drive Motor - Lapper—0.5 HP (0.37 kW)[5]
Drive Motor - Polisher—0.75 HP (0.56 kW)[5]
Length—25 inches (635 mm)[5]
Width—20 inches (508 mm)[5]
Height—24 inches (610 mm)[5]
Estimated Shipping Weight—285 lbs (129.3 kg)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]web.archive.orgweb.archive.org