Disco
DAD3241 alternatives
Comparable Dicing & Grinding equipment documented in the Waferpedia catalog.
6 comparable tools
Disco
R07
up to Φ8”
Dicing & Grinding
The Disco DAD3241 is an automatic dicing saw that supports workpieces up to Φ8" and uses Disco R07 blades for glass and silicon.
Lapmaster
15
Dicing & Grinding
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
Blanchard
18 D Surface
Dicing & Grinding
The Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
Blanchard
20 36 Surface
Dicing & Grinding
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
Blanchard
22 AD 42
Dicing & Grinding
Disco
321
Dicing & Grinding
Disco 321 is a wafer dicing saw designed for dicing semiconductor wafers.
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