Comparison ledger
Disco 3220, Disco DGP 8760 + DFM 2800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | DGP 8760 + DFM 2800Disco |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Disco DGP 8760 |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Configuration | — | Fully automatic[3] |
| Wafer Sizes | — | 8, 12 inch[3] |
| Fully automatic | — | Yes[3] |
| Power | — | 200 Vac, 3 Phase[3] |
| Inline UV irradiation system | — | Present[3] |
| Pre-Cut Dicing Tape | — | Yes[3] |
| Finish thickness min with wafer polishing | — | Up to 50ums[3] |
| Minimum finish thickness with wafer polishing | — | 50 µm[3] |
| Operation type | — | Fully automatic[3] |
| Configuration options | — | Stand-alone BG or in-line with wafer mounter[3] |
| Vintage year | — | 2009[3] |
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